Saint Petersburg Electrotechnical University LETI, Saint Petersburg, Russia

V. A. Tupik, Professor, Vice Rector for Research, Head of the Department of Microradioelectronics and Radio Technology, Doctor of Technical Sciences

V. I. Margolin, Professor at the Department of Microradioelectronics and Radio Technology, Academician at the Prokhorov Academy of Engineering Sciences, Doctor of Technical Sciences, e-mail: V.Margolin@mail.ru
D. K. Kostrin, Associate Professor, Deputy Head of the Department of Electronic Instruments and Devices, Candidate of Technical Sciences

Kurchatov Institute National Research Centre, Gorynin Central Research Institute of Structural Materials Prometey, Saint Petersburg, Russia:
B. V. Farmakovskiy, Associate Professor, Academic Secretary, Candidate of Technical Sciences

Magnetron sputtering is currently one of the techniques that offer most performance and precision when obtaining nanofilms, in particular metallic ones, such as titanium, silver, nickel and copper films. Such processes are normally performed in a high vacuum environment, which results in pure and high-purity films that are almost entirely free of impurities. Difficulty can arise when one needs to obtain thin films on substrates made of materials that cannot be subjected to heat during film deposition. Polymer films can serve as an example of such substrates. Nor should heat be used with substrates made of ferroelectric materials. It is often the case that multi-layer nanosized compositions should be deposited on such substrates in one process cycle. When polymer or piezoelectric films are used as substrates, it creates a number of issues as such films are quite sensitive to external effects. It means that one should ensure an appropriate temperature mode preventing a rise of more than 3 to 5 ^oC during deposition. That’s why one has to go layer by layer when doing one deposition cycle while maintaining the required temperature mode. One should also observe the established procedures when doing each layer. The developed unit consists of a vacuum chamber with a carousel type gear and substrate holders. The latter ensure multiple passages of substrates through the sputtering zone. And both sides of the substrate are sputtered in one process cycle. A substrate holder looks like two metal nonmagnetic frames with the sputtered film placed in between them.

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