Ioffe Physical−Technical Institute of RAS
A. L. Glazov, K. L. Muratikov
FID Technology Ltd.
V. A. Kozlov
Tallinn Technical University, Estonia
O. Korolkov
Processes of heat transfer through interfaces of semiconductor diode stack structures of high voltage pulse switchers are investigated by laser thermal wave methods. Theoretical model of thermal wave propagation in such structures is developed. It takes into account specific features of preparation of semiconductor element surfaces, layers of solder or bonding. It is shown that laser thermal wave methods can be applied to diagnostics of thermal contact quality between elements of opening switchers for various technologies of their assembling.
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